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Boise ID Full Time Posted: Saturday, 12 August 2017
 
 
Applicants must be eligible to work in the specified location

Req Id: 84710

Micron currently have openings for Process Development Engineers within the Advanced Packaging Technology Development organization. In this role, you will join an existing team of dedicated engineers responsible for researching, developing, characterizing, and transferring process solutions for wafer level 3D-Interconnect (3DI), Hybrid Memory Cube (HMC), Fan-Out packaging and other cutting-edge advanced packaging products. Currently this group is in need of exceptional team members focused in the process areas of Photolithography, Metrology/Inspection, Wet Process, Etch, CMP, PVD, CVD, Electroplating, and Temporary Wafer Bonding. As a member of our team you will play a crucial role in development of next generation processes and equipment required for enablement of advanced semiconductor package products. You will design experiments, conduct evaluations and propose process solutions utilizing innovative process materials and process equipment. This will require you to build and maintain effective constructive relationships with equipment and chemical suppliers. In this position, you will be required to interface with other Packaging and Semiconductor technologists within the international Micron team. Other major responsibilities include process maturity and characterization activities and involvement with the deployment of processes and equipment to Pilot and HVM manufacturing facilities. Opportunities for expanding process knowledge in many process areas also exist and will be encouraged. Please consider joining us as part of the of the 3DI process team dedicated to development and bring to market vertical stacked memory die solutions for Micron's constantly expanding memory products.

General Responsibilities and Tasks:

  • Translate stated package and stack construction requirements into measureable process requirements.
  • Drive process development and identify metrics based on stated requirements.
  • Develop quality assurance and quality control schemes for owned processes.
  • Provide development leadership from initial experimentation through manufacturing introduction.
  • Contribute knowledge and requirements to various teams to procure, install, and qualify equipment.
  • Work directly with key equipment suppliers to develop their equipment and processes to meet Micron's technological needs for 3Di devices.
  • Work directly with chemical analysis labs and equipment suppliers, and others to ensure best practices and compatibility with Micron's processes and to help drive the solutions for Micron's technical needs.
  • Transfer processes to HVM facilities, and ensure proper documentation of requirements for equipment and facilities, metrology, quality control, and procedures.
  • Coordinate activities for all team owned equipment.
  • May be required to lead process development teams.
  • Become Proficient in Micron's data collection and analysis software and techniques as well as forming solid conclusions and providing clear communication of that data
  • Research and develop novel solutions to enable technology gap closure

Qualifications:

  • Candidates will need to be self-motivated and able to work independently as well as in cross-functional groups.
  • Excellent understanding of process development, equipment development, and materials development cycles
  • Proficient experience in process ownership and development is required
  • Knowledgeable of the process variables affecting the etch and clean processes and how they affect the quality of the product as well as SPC methods to characterize performance.
  • Experience in additional group disciplines in semiconductor processing will be a major benefit.
  • Excellent organizational, data collection and analysis.
  • Experience with, and excellent understanding of surface analysis techniques like XPS, AFM, XRD, AES, etc
  • Excellent oral and written communication skills and a strong attention to detail.
  • Able to work productively in a group as leader and a contributor.
  • Experience with project management.
  • Skilled at DOE creation and evaluation.
  • Ability to facilitate groups and meeting requirements.

Education: MS or PhD in Materials Science and Engineering, Chemical Engineering, Mechanical Engineering, or related discipline is required. A B.S. degree with 5+ years of industry experience in Semiconductor Process Engineering will be considered.

We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran's status, or other classifications protected under law. This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.

Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.

To request assistance with the application process, please contact Micron's Human Resources Department at 1-800-336-8918 (or 208-368-4748).

Keywords: Boise || Idaho (US-ID) || United States (US) || Technology Development || College || Regular || Engineering ||.LI-DK1 ||

Boise ID, United States of America
IT
Micron
Micron
JS84710-EN_US
8/12/2017 11:53:22 PM


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