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Job Description Experienced Development Engineer capable of developing Plating processes to meet the needs of next generation semiconductor devices. Defines and implements processes related to e-test, film thickness and layer performance criteria for production. Collaborate with diverse teams to setup Plate processes meeting integration needs. Technical owner of consumable characterization data methodology, analysis techniques, and recipe setup for quality control to optimize yield. Defines and implements Plate roadmaps, quality control, failure analysis, and testing methodologies to meet... more ->
Job Description As a Photolithography Scanner Engineer, you'll be part of Intel's High-Volume Manufacturing (HVM) fabrication process development team that is driving innovation for the next generation of silicon products. You will play a critical role in the development of lithography process for new technology nodes while managing tool productivity, process quality, yield improvements, and HVM readiness. You will partner with Process Integrators and other Process Engineers to develop recipes/processes and HVM systems for new products. Responsibilities include the following but are not... more ->
Job Description As a Silicon Photonics (SiP) Process Integration Engineer, you will be part of Intel's SiP Process Development and Manufacturing (SPDM) team that is leading Intel's market transition and driving innovation for the next generation of optical interconnect products. You will play a critical role in the next generation of silicon photonics fabrication processes by improving yield/reliability, process capability and manufacturability. The Silicon Photonics TD Process Integration Engineer will be responsible for but not limited to: Collaborates with Yield Analysis, Device and Defect... more ->